siXis, Inc. Introduces Reconfigurable Computing Platform

RESEARCH TRIANGLE PARK, N.C., Sep 22, 2009 (BUSINESS WIRE) — siXis, Inc., pioneers of advanced Silicon Circuit Board (SiCB) technology, introduced the SX2000 Reconfigurable Computing Platform, a scalable, high-performance reconfigurable computing platform designed to streamline and accelerate data-intensive applications. Through a heterogeneous mix of FPGA and microprocessors, the SX2000 delivers the industry’s leading I/O bandwidth combined with extensive computation capabilities.

“The SX2000 resulted naturally from our efforts to build a more efficient reconfigurable computing platform technology,” said John Goehrke, President and CEO of siXis. “What the market will truly appreciate is that not only does the SX2000 deliver the high I/O bandwidth and advanced computational capability it needs, but it’s also scalable in unlimited fashion, no matter the application.”

Any application with high-volume data processing needs can benefit from the SX2000 Reconfigurable Computing Platform, especially those using Monte Carlo modeling, image processing/analysis, bioinformatics algorithmic acceleration and high speed encryption/decryption.

“With the SX2000 we’re able to provide high-performance computing in a 1U rack,” explained siXis VP of Engineering, David Blaker. Specifically, the SX2000 offers four fully interconnected compute nodes, each featuring an Altera Stratix IV(R)EP4SGX23OK FPGA with 2 Gbytes DDR3 memory, four QSFP high-speed serial ports, and a 1.5 GHz Freescale MPC8536E PowerQUICC(R) III processor with 512 Mbytes DDR3 memory. “The next generation of the SX2000 will employ the company’s embedded computing module and underlying silicon circuit board technologies which will improve the computing density by a factor of 4X,” added Mr. Blaker.

The SX2000 Reconfigurable Computing Platform is available immediately with a six to eight week lead time ARO.

siXis will be exhibiting at SC09, an international conference for high-performance computing, networking, storage and analysis in Portland, Oregon, November 14-20. The company will be demonstrating the SX2000 at the conference in booth #2285.

About siXis, Inc.

siXis has created the next generation of embedded computing modules that pave the way for smaller, higher performing, scalable, and lighter electronics that use less power. siXis’ patent-pending approach uses Silicon Circuit Board (SiCB) technology which combines bare-die and packaged components on large-area silicon substrate, providing superior size, weight, and power characteristics in an industry-standard BGA package.

Using a number of variations, including different CPUs, FPGAs, memory and oscillators, siXis custom embedded computing modules deliver higher performance in a smaller, energy efficient package for a diverse group of markets including communications, high-performance computing, networking, medical imaging, test and measurement, aerospace and defense.

The company, created with technology developed at RTI International, received CED’s 2008 Entrepreneurial Excellence Spin-Out of the Year Award, and is a winner of TechJournal South’s 2009 Tech 50 award. For more information, please visit www.sixisinc.com.

SOURCE: siXis, Inc.
siXis, Inc.
John Goehrke, 919.248.4112
info@siXisinc.com
www.siXisinc.com
Copyright Business Wire 2009